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Chip-on-board Technology

  • Keeler R
Springer Berlin Heidelberg, (1985), 41-45
DOI: 10.1007/978-3-662-13161-9_9
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Abstract

After many years of development, hybrid and chip-on-board or COB technology has reached the stage where considerable savings in space and cost are achievable. This article reviews the most important features of these technologies, together with the manufacturing equipment necessary for their practical use.

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APA

Keeler, R. (1985). Chip-on-board Technology. In The Electronics Assembly Handbook (pp. 41–45). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_9

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