Investigations of wire-bonded micro heat pipes-a review

Abstract

Micro heat pipes have found applications in numerous types of systems where effective heat dissipation in a limited space is required. One relatively new design/fabrication methodology for parallel micro heat pipes with high performance is referred to as “wire-bonded” micro heat pipe arrays. The following review analyzes the principles of operation of these devices and investigates the recent developments in the technology, along with their fabrication and application. The results indicate that these micro heat pipe arrays present an attractive alternative for a number of interesting applications, including many that have yet to be explored.