Detailed punching-process analysis is difficult because the punch diameter, sheet thickness, clearance, and die wear of the punching-process are approximately 10 mm, 1 mm, 100 μm, and 10 μm, respectively. Furthermore, such analyses have rarely considered die wear. Therefore, in the present study, we set the mesh size in the neighborhood of the die corner radius and the punch to 1/10 μm. Moreover, we analyze the punching process considering die wear. We investigated the stress, incremental strain, and equivalent strain for different levels of die wear.
CITATION STYLE
Ueda, T., Iizuka, T., & Enoki, S. (2016). FEM Analysis of Punching-Process in Consideration of Micro Die Wear. In MATEC Web of Conferences (Vol. 80). EDP Sciences. https://doi.org/10.1051/matecconf/20168015006
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