Skip to main content
Book Chapter

Liquid Nitrogen Spray Cooling of a Simulated Electronic Chip

  • Tilton D
  • Kearns D
  • Tilton C
Springer US, (1994), 1779-1786
DOI: 10.1007/978-1-4615-2522-6_217
N/ACitations
Citations of this article
8Readers
Mendeley users who have this article in their library.
Get full text

Abstract

Evaporative spray cooling with liquid nitrogen is investigated as a candidate method for thermal management of electronic assemblies utilizing High Temperature Super-Conducting (HTSC) materials. A heated copper surface simulating an electronic chip is cooled in two...

Cite

CITATION STYLE

APA

Tilton, D. E., Kearns, D. A., & Tilton, C. L. (1994). Liquid Nitrogen Spray Cooling of a Simulated Electronic Chip. In Advances in Cryogenic Engineering (pp. 1779–1786). Springer US. https://doi.org/10.1007/978-1-4615-2522-6_217

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free