Adhesion strength between thermoplastics and its polyurethane coating made by using the technology combination of injection molding and reaction injection molding

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Abstract

A complete equipment for injection molding (IM) of a thermoplastic (TP) carrier and reaction injection molding (RIM) of polyurethane (PUR) coatings including IM and RIM machines, a color module for PUR, and a robot was built up. A modularly composed sliding split mold was constructed and manufactured allowing different parts including thicker (2 mm thickness) soft touch and thin (0.4 mm) lacquer PUR coatings. As TP PC/ABS and PA6 GF15 compounds were used, and aromatic and aliphatic PUR systems as well. From the parts made by IM+RIM, test specimens for peel force measurements were cut. These investigations were performed prior and after ageing under climatic conditions @ 50 % RH and temperature changes between -30 °C and 90 °C. By varying IM processing parameters, we have found that mold and TP temperatures are particularly important for the adhesion strength between TP and PUR. The waiting time between the end of TP cooling and PUR injection has a minor influence on its mean value. However, to short waiting times may result in inhomogeneous adhesion. It was surprising that surface defects of the TP carrier leads also to inhomogeneous adhesion. We have observed that ageing may cause an increase and decrease of adhesions strength depending on the TP+PUR system used. We have found that the results are valid only for the actual TP and PUR combination. A generalization seems to be inappropriate, hence, the actual combination should be investigated to prevent unwanted surprises when the coated TP part is in its application. © 2014 American Institute of Physics.

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APA

Bloß, P., Böhme, A., Müller, J., Krajewsky, P., & Michaelis, J. (2014). Adhesion strength between thermoplastics and its polyurethane coating made by using the technology combination of injection molding and reaction injection molding. In AIP Conference Proceedings (Vol. 1593, pp. 670–673). American Institute of Physics Inc. https://doi.org/10.1063/1.4873868

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