Lead-Free board surface finishes

Abstract

In the move to lead-free electronics, one of the main aspects of printed wiring board (PWB) fabrication that has received attention is the surface finish. The surface finish of the PWB represents the last major step in fabrication before component assembly and, as such, represents the interface between the external board circuitry and the bonding medium (i.e. solder). The use of lead-free solders requires higher assembly temperatures and places increased demands on the surface finish if it is to survive multiple reflow cycles. In PWB fabrication, the surface finish can serve several interrelated functions, including: © 2007 Springer-Verlag US.