EUVL system: moving towards production

  • Meiling H
  • Buzing N
  • Cummings K
  • et al.
43Citations
Citations of this article
20Readers
Mendeley users who have this article in their library.

Abstract

Single exposure lithography is the most cost effective means of achieving critical level exposures, and extreme ultraviolet lithography (EUVL) is the technology that will enable this for 27nm production and below. ASML is actively engaged in the development of a multi generation production EUVL system platform that builds on TWINSCANâ„¢ technology and the designs and experience gained from the build, maintenance, and use of the Alpha Demo Tools (ADTs). The ADTs are full field step-and-scan exposure systems for EUVL and are being used at two research centers for EUVL process development by more than 10 of the major semiconductor chip makers, along with all major suppliers of masks and resist. In this paper, we will present our EUVL roadmap, and the manufacturing status of the projection lens for our first production system. Included will also be some test data on the new reticle pods. Experimental results from ADT showing the progress in imaging (28 nm half pitch 1:1 lines/spaces CDU ~10%), single machine overlay down to 3 nm, and resist complete the paper.

Cite

CITATION STYLE

APA

Meiling, H., Buzing, N., Cummings, K., Harned, N., Hultermans, B., de Jonge, R., … Zimmerman, J. (2009). EUVL system: moving towards production. In Alternative Lithographic Technologies (Vol. 7271, p. 727102). SPIE. https://doi.org/10.1117/12.814041

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free