Cu Plating with Sn and Subsequent Bronze Formation under Mild Conditions

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Abstract

In a well-known bronze plating experiment, a Cu coupon is subjected to Sn plating and heating with a Bunsen burner. Currently, aqueous NaOH or HCl is typically used as the plating solution; however, the use of a strong acid or base provides operational risks, particularly in educational settings (e.g., schools). Herein, we introduce a modified method that uses aqueous NaHSO4 as the plating solution. This method reduces the operational risks and allows for the smooth deposition of silver-white Sn onto the Cu coupon in a higher yield than that obtained by the HCl method, which uses 30 times the concentration of the solute. When the Sn-plated Cu coupon is heated, it changes to bronze plating. This experiment is ideal for high school students, as it allows them to observe metal plating and solid diffusion.

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Suzuki, T., & Inoue, M. (2021). Cu Plating with Sn and Subsequent Bronze Formation under Mild Conditions. Journal of Chemical Education, 98(3), 946–950. https://doi.org/10.1021/acs.jchemed.0c00552

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