This chapter addresses the key thermal mechanisms active in light-emitting diode (LED) packaging and describes a big-picture approach to thermal design of the LED package. It also highlights differences in thermal phenomena between LED chips and integrated circuit (IC) semiconductor chips. Best-practice thermal design activities are identified.
CITATION STYLE
Biber, C. (2014). Basics of Thermal Design for LEDs (pp. 53–69). https://doi.org/10.1007/978-1-4614-5091-7_3
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