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High Pressure Thermal Bonding for Sealing of Plastic Microstructures

  • Rosenberger F
  • Jones E
  • Lee C
  • et al.
Springer Netherlands, (2002), 404-406
DOI: 10.1007/978-94-010-0295-0_135
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Abstract

A process for the sealing of microchannels in polycarbonate substrates via high pressure thermal bonding is investigated. Bond strength tests was performed for different bond pressures and temperatures. The crack-opening method was used to characterize the bond strength relative to other tested devices. Channel collapse of an embedded microchannel was also characterized as a function of bonding parameters.

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Rosenberger, F., Jones, E., Lee, C., & DeVoe, D. (2002). High Pressure Thermal Bonding for Sealing of Plastic Microstructures. In Micro Total Analysis Systems 2002 (pp. 404–406). Springer Netherlands. https://doi.org/10.1007/978-94-010-0295-0_135

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