Reliability Improvement of Single-Shot Device

Abstract

Reliability demonstration and reliability improvement of a single-shot device (SSD) mainly depend on quality processes involved during selection and manufacturing of components, assembly/integration, environmental testing (vibration, bump, temperature conditioning, water immersion, etc.) and functional tests under different operating conditions (ambient, high altitude and desert). After a thorough root-cause analysis based on the Fault Tree Analysis and critical examination of the delayed functioning mechanism, the corrective actions were implemented. Further, the reliability requirements and the delay functioning requirements were met completely during developmental trials. Failures during developmental trials reveal that root cause for defects is due to human error, insufficient quality process, inadequate training and failure in addressing reliability aspects during design stage, etc. To conclude, the lesson learnt from the study was that the stringent reliability analysis of the product should be done, during initial design stage of the product, by identifying potential failure modes of the product and by addressing them prudently.