A Low-Cost, Micropattern Transfer Process for Thick-Film Metallization of PDMS

  • Hilbich D
  • Gray B
  • Shannon L
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Abstract

We present the detailed characterization of a novel microfabrication process to produce thick-film copper microstructures that are embedded in polydimethylsiloxane (PDMS). This process has reduced fabrication complexity and cost compared to existing metal-on-PDMS techniques and enables rapid prototyping of designs using minimal microfabrication equipment. This technology differs from others in its use of a conductive copper paint seed layer and a unique infrared-assisted transfer process that results in copper microstructures embedded in PDMS. By embedding microstructures flush with the PDMS surface, rather than fabricating the microstructures on the substrate surface, we produce a metallization layer that adheres to PDMS without the need for surface modifications. In addition, the electrodeposition process results in a highly-conductive, thick-film, copper layer. Deposited patterns are shown to be 70-micrometers-thick with reliable feature sizes as small as 100 micrometers. The copper layer has a surface roughness of approximately 5 micrometers and a low film resistivity of approximately 2.5-3 micro-Ω-cm.

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Hilbich, D., Gray, B. L., & Shannon, L. (2017). A Low-Cost, Micropattern Transfer Process for Thick-Film Metallization of PDMS. Journal of The Electrochemical Society, 164(5), B3067–B3076. https://doi.org/10.1149/2.0111705jes

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