Abstract
Methods involved in gold-stud bump bonding of VLSI chips to solid state sensors are described. Applicability and limitations of the techniques are discussed in the context of pad size and pitch of the detection elements on the sensors. Recommendations are made for preferred surface preparation of bonding pads. © 2010 IOP Publishing Ltd and SISSA.
Author supplied keywords
Cite
CITATION STYLE
APA
Tripathi, S. M., Holbrook, B., Irving, M., Lander, R. L., Woods, M., Brau, J. E., … Nelson, T. (2010). Gold-stud bump bonding for HEP applications. Journal of Instrumentation, 5(8). https://doi.org/10.1088/1748-0221/5/08/C08005
Register to see more suggestions
Mendeley helps you to discover research relevant for your work.
Already have an account? Sign in
Sign up for free