Thin chips for power applications

Abstract

Thin chips for power applications are the key enabler for energy efficiency. This chapter will view low voltage metal oxide semiconductor field effect transistors (MOSFETs), IGBTs (insulated gate bipolar transistors) and FWDs (free wheeling diodes). For these the trend to ultra-thin power transistor chips (20 μm thickness) and the resulting electrical and thermal benefits by chip thickness reduction is described. Further the influence of thin chips on product definition and application especially for automotive smart power devices is pointed out. Thin chips technology for power applications allow an increase in efficiency and new packaging processes of semiconductor devices. The application benefits include reduced area requirements for the same performance and new packaging processes. © 2011 Springer Science+Business Media, LLC.