Abstract
Scientific and engineering advancements during the past decades in micro and nano devices have brought previously unthinkable applications to reality, such as in space systems, environmental instruments, and daily life appliances. However, a low cost and reliable packaging solution for MEMS/NEMS products remains a very difficult task. This chapter presents the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends.
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Chiao, M., Cheng, Y. T., & Lin, L. (2013). Introduction to MEMS packaging. In Microsystems and Nanotechnology (Vol. 9783642182938, pp. 415–446). Springer-Verlag Berlin Heidelberg. https://doi.org/10.1007/978-3-642-18293-8_11
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