Book - 3D IC Heterogeneous Integration by FOWLP
CITATION STYLE
Lau, J. H. (2018). Embedded Chip Packaging. In Fan-Out Wafer-Level Packaging (pp. 115–125). Springer Singapore. https://doi.org/10.1007/978-981-10-8884-1_4
Mendeley helps you to discover research relevant for your work.