Investigation of low-frequency noise characterization of 28-nm high-k pMOSFET with embedded SiGe source/drain

2Citations
Citations of this article
7Readers
Mendeley users who have this article in their library.

This article is free to access.

Abstract

We have studied the low-frequency noise characterizations in 28-nm high-k (HK) pMOSFET with embedded SiGe source/drain (S/D) through 1 / f noise and random telegraph noise measurements simultaneously. It is found that uniaxial compressive strain really existed in HK pMOSFET with embedded SiGe S/D. The compressive strain induced the decrease in the tunneling attenuation length reflecting in the oxide trap depth from Si/SiO2 interface to the HK layer, so that the oxide traps at a distance from insulator/semiconductor interface cannot capture carrier in the channel. Consequently, lower 1 / f noise level in HK pMOSFET with embedded SiGe S/D is observed, thanks to the less carrier fluctuations from trapping/detrapping behaviors. This result represents an intrinsic benefit of HK pMOSFET using embedded SiGe S/D in low-frequency noise characteristics. © 2014 Shih-Chang Tsai et al.

Cite

CITATION STYLE

APA

Tsai, S. C., Wu, S. L., Chen, J. F., Wang, B. C., Huang, P. C., Tsai, K. S., … Fang, Y. K. (2014). Investigation of low-frequency noise characterization of 28-nm high-k pMOSFET with embedded SiGe source/drain. Journal of Nanomaterials, 2014. https://doi.org/10.1155/2014/787132

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free