We have studied the low-frequency noise characterizations in 28-nm high-k (HK) pMOSFET with embedded SiGe source/drain (S/D) through 1 / f noise and random telegraph noise measurements simultaneously. It is found that uniaxial compressive strain really existed in HK pMOSFET with embedded SiGe S/D. The compressive strain induced the decrease in the tunneling attenuation length reflecting in the oxide trap depth from Si/SiO2 interface to the HK layer, so that the oxide traps at a distance from insulator/semiconductor interface cannot capture carrier in the channel. Consequently, lower 1 / f noise level in HK pMOSFET with embedded SiGe S/D is observed, thanks to the less carrier fluctuations from trapping/detrapping behaviors. This result represents an intrinsic benefit of HK pMOSFET using embedded SiGe S/D in low-frequency noise characteristics. © 2014 Shih-Chang Tsai et al.
CITATION STYLE
Tsai, S. C., Wu, S. L., Chen, J. F., Wang, B. C., Huang, P. C., Tsai, K. S., … Fang, Y. K. (2014). Investigation of low-frequency noise characterization of 28-nm high-k pMOSFET with embedded SiGe source/drain. Journal of Nanomaterials, 2014. https://doi.org/10.1155/2014/787132
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