3D integration technologies - An overview

Abstract

The next generation of integrated micro-system technologies can only keep up with increased functionality and performance demands by using the 3rd dimension. The primary drivers for 3D integration are miniaturization, integration of different technologies in a small form-factor, and performance. 3D integration technologies can be grouped into 3 main categories, namely 3D On-chip integration, 3D IC-stacking, and 3D-packaging. This chapter provides a detailed review of each of these categories. © 2009 Springer-Verlag US.