Abstract
This chapter provides an overview of the technology of embedding chips into laminates. The motivation, an overview of technological approaches and the challenges will be outlined. One of the technologies will be described in more detail through a case of an application. Finally a technological outlook is given in consideration of the innovations the embedded technology could make possible. © 2011 Springer Science+Business Media, LLC.
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CITATION STYLE
APA
Kugler, A., Koyuncu, M., Zimmermann, A., & Kostelnik, J. (2011). Chip embedding in laminates. In Ultra-thin Chip Technology and Applications (pp. 159–165). Springer New York. https://doi.org/10.1007/978-1-4419-7276-7_14
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