Acoustic waveform energy as an interconnect damage indicator

Abstract

The industry standard process for determining safe assembly bending levels uses failure analysis following destructive stress testing to determine solder joint damage - a time-consuming and expensive process. Modal acoustic emission detection has been used to indicate the initiation of interconnect damage based on the energy of the waveforms, where a sudden increase in energy was observed at strain levels corresponding to interconnect damage. The test method and results are presented, and the use of event waveform energy is discussed. © The Society for Experimental Mechanics, Inc. 2014.