Depth-sensing nanoindentation techniques for nanomechanical characterization

Abstract

To measure nanomechanical properties of surface layers of bulk materials and thin films, depth-sensing nanoindentation measurement techniques are used commonly. The nanoindentation apparatus continuously monitors the load and the position of the indenter relative to the surface of the specimen (depth of an indent or displacement) during the indentation process. Indentation experiments can be performed at a penetration depth of as low as about 5 nm. This chapter presents an overview of various nanoindentation techniques, various measurement options, and data analysis. Data on elastic-plastic deformation behavior, hardness, elastic modulus, scratch resistance, film-substrate adhesion, residual stresses, time-dependent creep and relaxation properties, fracture toughness, and fatigue are presented.