Achieving semiconductor assembly and test manufacturing excellence via manufacturing execution system

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Abstract

Manufacturing cost reduction, product quality improvement, training, new product introduction, and cycle time fluctuation are common challenges for semiconductor assembly and test manufacturing (ATM) factories. Manufacturing Execution System (MES) as the bridge connecting Enterprise Resource Planning (ERP) and Process Control System (PCS) is essential for manufacturing to collect real- Time product line information, support manufacturing decision making/scheduling and increase manufacturing efficiency. This paper will present the operational complexities that are integrated into the MES solution. Based on the special features of ATM and data warehouse technology, the MES architecture has been designed with four layers of integrated automation system including basic functions, data layer, business objects/methods and user interface. As the MES adopting this approach turns into reality, overall manufacturing competition advantage and production process management improve greatly. Furthermore, this system has been applied to all Intel ATM factories. The successful implementation of this system has explored a new approach for the high volume manufacturing systems in discrete manufacturing enterprise. © Springer-Verlag Berlin Heidelberg 2010.

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APA

Liu, Y., Li, Y., & Yao, J. (2010). Achieving semiconductor assembly and test manufacturing excellence via manufacturing execution system. In Advances in Intelligent and Soft Computing (Vol. 66 AISC, pp. 757–771). Springer Verlag. https://doi.org/10.1007/978-3-642-10430-5_59

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