Lead-Free surface mount assembly

Abstract

In general, the process flow for lead-free surface mount assembly process is similar to the conventional SnPb soldering process. Often the same equipment set used for SnPb can be used for lead-free reflow soldering. However, there are some differences that must be taken into account. The material set used for lead-free soldering is different and typically higher reflow temperatures are required. This chapter will review the different aspects of the discuss its impact on design, equipment, process and materials. surface mount assembly process with respect to lead-free solder and © 2007 Springer-Verlag US.