This chapter describes the method of manufacturing microfluidic microchannels formed by delaminated buckled thin films. Thin films under compression tend to delaminate and buckle. Microchannel geometry can be controlled by tailoring film residual stress and placing patterned adhesion-weakening layers utilizing photolithographic techniques. Results based on the photoresist as the adhesion weakening layer and compressed tungsten thin films are described along with the corresponding thin film mechanics.
CITATION STYLE
Volinsky, A. A., & Waters, P. (2013). Delaminated film buckling microchannels. In Mechanical Self-Assembly: Science and Applications (Vol. 9781461445623, pp. 153–170). Springer New York. https://doi.org/10.1007/978-1-4614-4562-3_8
Mendeley helps you to discover research relevant for your work.