Material Removal Behavior in Ultrasonic Assisted Grinding of SiC Ceramics

Abstract

In order to investigate the material removal behavior in ultrasonic assisted grinding of SiC ceramics, simulation of the ultrasonic-assisted scratching using the smooth particle hydrodynamics (SPH) are operated. Meanwhile, the ultrasonic-assisted scratching tests are operated on the constructed ultrasonic assisted scratching (UAS) unit for comparison. The results show that there are two scratching modes in the UAS process: An intermittent mode and a continuous mode. The critical depth of cut in UAS is deeper than that in conventional scratching and ultrasonic assisted internal grinding of SiC ceramics. This study confirmed that ultrasonic assisted grinding can easily achieve the ductile grinding.