Development of Next Generation Post Copper CMP Cleaners

  • Kuroda A
  • Otake A
  • Bernatis P
3Citations
Citations of this article
6Readers
Mendeley users who have this article in their library.
Get full text

Abstract

Development of post copper CMP cleaning formulations that effectively remove the residues left from the CMP step and corrosion at the conductor and barrier to almost undetectable levels is described. Organic residue removal efficiency and corrosion of interconnects and barrier materials are discussed. Post CMP particle and residue defectivity data will also be presented to demonstrate the cleaning efficiency of the new formulations.

Cite

CITATION STYLE

APA

Kuroda, A., Otake, A., & Bernatis, P. (2013). Development of Next Generation Post Copper CMP Cleaners. ECS Transactions, 52(1), 575–580. https://doi.org/10.1149/05201.0575ecst

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free