In the era of the nanometer CMOS technology, due to stringent system requirements in power and performance, microprocessor manufacturers are relying more on chip multi-processor (CMP) designs. CMPs partition silicon real estate among a number of processor cores and on-chip caches, and these components are connected via an on-chip interconnection network (Network-on-chip). It is projected that communication via NoC is one of the primary limiters to both performance and power consumption. To mitigate such problems, we explore the use of multiband RF-interconnect (RF-I) which can communicate simultaneously through multiple frequency bands with low power signal transmission and reconfigurable bandwidth. At the same time, we investigate the CMOS mixed-signal circuit implementation challenges for improving the RF-I signaling integrity and efficiency. Furthermore, we propose a micro-architectural framework that can be used to facilitate the exploration of scalable low power NoC architectures based on physical planning and prototyping. © 2011 Springer Science+Business Media LLC.
CITATION STYLE
Tam, S. W., Socher, E., Chang, M. C. F., Cong, J., & Reinman, G. D. (2011). RF-interconnect for future network-on-chip. In Low Power Networks-On-Chip (pp. 255–280). Springer. https://doi.org/10.1007/978-1-4419-6911-8_10
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