Thermal design of electronic equipment based on parametric simulation

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Abstract

In this paper, the thermal design of a kind of electronic equipment based on parametric simulation has been researched. The research which uses the ANSYS Workbench as the platform has taken the fin number and the fin thickness as the design variables, the fin weight as the constraint condition, the shell temperature of the heat source as the objective function. The results indicate that the fin number and the fin thickness are both the important parameters which affect the fin weight and the shell temperature of the heat source, which are the main research objects of the fin thermal design; in order to control the fin weight and reduce the shell temperature of the heat source, the fin parameter combination of a larger number and thinner thickness of the fin should be selected. Parametric simulation has played a great role in obtaining the best fin parameter combination and raising the efficiency of thermal design.

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Pan, H., Ma, L., Zhu, L., & Wang, H. (2020). Thermal design of electronic equipment based on parametric simulation. In Lecture Notes in Electrical Engineering (Vol. 589, pp. 319–325). Springer Verlag. https://doi.org/10.1007/978-981-32-9441-7_32

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