In this work, we report the effect of stress generated in a photo-resist film during micro lithography sequence and its impact on selective electro plating process. Series of experiments were carried out to find an optimum pre-bake temperature which resulted in more control over stress generated in the photo-resist film and hence seepage free smooth plating process.
CITATION STYLE
Kumar, N., Jat, R. K., Kumar, P., Saini, H. K., Lata, S., Chaubey, R. K., … Rawal, D. S. (2019). Thermal control of stress in photoresist film for improving selectivity in electro-plating process. In Springer Proceedings in Physics (Vol. 215, pp. 269–272). Springer Science and Business Media, LLC. https://doi.org/10.1007/978-3-319-97604-4_41
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