Metal-oxide-semiconductor field-effect-transistors on indium phosphide using HfO2 and silicon passivation layer with equivalent oxide thickness of 18 Å

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Abstract

In this letter, we demonstrate the electrical properties of metal-oxide-semiconductor capacitors and metal-oxide-semiconductor field-effect transistors (MOSFETs) on InP using atomic layer deposited HfO2 gate dielectric and a thin silicon interface passivation layer (Si IPL). Compared with single HfO2, the use of Si IPL results in better interface quality with InP substrate, as illustrated by smaller frequency dispersion and reduced hysteresis. MOSFETs with Si IPL show much higher drive current and transconductance, improved subthreshold swing, interface-trap density and gate leakage current with equivalent oxide thickness scaling down to 18 Å. © 2009 American Institute of Physics.

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Chen, Y. T., Zhao, H., Yum, J. H., Wang, Y., & Lee, J. C. (2009). Metal-oxide-semiconductor field-effect-transistors on indium phosphide using HfO2 and silicon passivation layer with equivalent oxide thickness of 18 Å. Applied Physics Letters, 94(21). https://doi.org/10.1063/1.3143629

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