Improvement in the adhesion of polyimide/epoxy joints using various curing agents

Abstract

An improvement in the adhesion strength of polyimide/epoxy joints was obtained by (1) introducing a functional group on the polyimide surface, (2) improving the mechanical properties of the epoxy adhesive, (3) increasing the curing temperature, and (4) using polyamic acid as an adhesion-promoting layer. The functional group on polyimide was introduced via treatment with aqueous KOH. An adhesion-promoting layer was formed by spin coating polyamic acid onto a modified polyimide surface. The maximum adhesion strength of the polyimide/epoxy joint was obtained using polyamic acid as both the adhesion-promoting layer and as the curing agent. The surface energy of the modified polyimide was examined using contact angle measurements and Fourier transform infrared spectroscopy, and the peel strength was determined by the T-peel method. The peeled surfaces were analyzed using scanning electron microscopy and X-ray photoelectron spectroscopy.