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Journal ArticleOPEN ACCESS

Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications

  • Yoon J
  • Bang J
  • Ko Y
  • et al.
Journal of the Microelectronics and Packaging Society (2014) 21(4) 1-13
DOI: 10.6117/kmeps.2014.21.4.001
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Abstract

… of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more … technologies, heat dissipation and thermal management of advanced power modules with extended …

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APA

Yoon, J.-W., Bang, J.-H., Ko, Y.-H., Yoo, S.-H., Kim, J.-K., & Lee, C.-W. (2014). Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications. Journal of the Microelectronics and Packaging Society, 21(4), 1–13. https://doi.org/10.6117/kmeps.2014.21.4.001

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