With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
CITATION STYLE
Young, A. M., & Koester, S. J. (2010). 3D Process Technology Considerations (pp. 15–32). https://doi.org/10.1007/978-1-4419-0784-4_2
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