3D Process Technology Considerations

  • Young A
  • Koester S
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Abstract

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.

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Young, A. M., & Koester, S. J. (2010). 3D Process Technology Considerations (pp. 15–32). https://doi.org/10.1007/978-1-4419-0784-4_2

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