CITATION STYLE
Zienert, I., Prinz, H., Geisler, H., & Zschech, E. (2006). Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction. In Materials for Information Technology (pp. 241–249). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_21
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