Optimization of a wavy microchannel heat sink with grooves

Abstract

In this study, a wavy microchannel heat sink with grooves using water as the working fluid is proposed for application to cooling microprocessors. The geometry of the heat sink was optimized to improve heat transfer and pressure loss simultaneously. To achieve optimization goals, the average friction factor and thermal resistance were used as the objective functions. Three dimensionless parameters were selected as design variables: the distance between staggered grooves, groove width, and groove depth. A modified Latin hypercube sampling (LHS) method that combines the advantages of conventional LHS and a three‐level full factorial method is also proposed. Response surface approximation was used to construct surrogate models, and Paretooptimal solutions were obtained with a multi‐objective genetic algorithm. The modified LHS was proven to have better performance than the conventional LHS and full factorial methods in the present optimization problem. A representative optimal design showed that both the thermal resistance and friction factor improved by 1.55% and 3.00%, compared to a reference design, respectively.