3D transitions and connections

Abstract

In this chapter, we will consider four types of 3D transitions. Each transition type has its own challenges, but each follows the design principles of keeping the transition as compact as possible and using transmission lines as the transition element. The transitions considered here are: 1. Vertical Transitions Between Planar Transmission Lines: We will consider the microstrip to stripline transition in co-fired ceramic substrates. 2.Vertical Transitions Using Stacked Die and Through Silicon Vias: In this approach, integrated circuits are stacked on top of each other and interconnects are made between them. 3. 3D Transitions Using Connectors: Transition connectors transfer the RF signal from one layer to another layer in the packaging. The fuzz button connector and elastomeric connectors were mentioned in the previous chapter. In this chapter, the SMP connector is described. 4. Vertical Transition Using Balls or Bumps: These vertical interconnects are sued with flip chip ICs.