ANALISIS INTERFACIAL REACTION ANTARA SUBSTRATE Cu DAN SOLDER 96.5Sn3.0Ag-0.5Cu (SAC305) UNTUK PENGEMBANGAN APLIKASI SEMIKONDUKTOR

Abstract

Cu substrate and SAC305 solder are some semiconductor materials. The solder joint must have good metallurgical bond strength when the solder and the substrate are joined together. The benefits of soldering will later make interconnections between electrical connections in one substrate that will form a compound or IMC layer. Where the formation of intermetallic compounds (IMC) in the reaction results will be an important role in forming a good bond between the solder and the substrate. Therefore, this research was conducted to analyze the interfacial reaction that occurs between Cu substrate and SAC305 solder when put together. In the preparation stage, the Cu substrate specimen will be cut according to the predetermined dimensions and the cleaning process is carried out on the SAC305 solder ball. After the sample preparation process was carried out the Interfacial Reaction Couple process, the Cu substrate and the SAC305 solder ball were weighed in a 1: 3 ratio and the specimen substrate was immersed in the flux on both sides of the specimen. After that, the Cu substrate specimens and SAC305 solder balls were arranged regularly and placed into the quartz tube and the heating process was carried out in the furnace with reflow temperatures of 270 o C, 290 o C, 310 o C, and 330 o C with a reaction time of 50 minutes. The results of the reaction formed between the Cu substrate and the SAC305 solder ball were then sanded and a characterization process was carried out using an optical microscope to see the microstructure formed and characterization of materials in the form of SEM, EDS and XRD. The test results show that the IMC thickness value will increase with the increase in temperature variations. As well as the discovery of Cu6Sn5 phases which formed the scallop layer and Cu3Sn which formed planar close to the Cu substrate in the IMC layer.