Investigation of thermal parameters effects on the microstructure, microhardness and microsegregation of Cu-Sn alloy directionally solidified under transient heat flow conditions

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Abstract

The microstructure and mechanical properties of cast materials are strongly dependent on the thermal history during solidification process. The global casting industry has faced major challenges, i.e., customers increasingly demand completely finished cast parts as well as complexity of casting alloys are rising. Therefore, the previous knowledge the solidification conditions effects on the as-cast ingot microstructure and mechanical properties resulting is very useful in the casting industry in order to improve the casting quality. In this present paper, the thermal parameters effects on the microstructure, microhardness and microsegregation of a Cu- 20 wt.% Sn alloy under transient heat flow conditions were experimentally investigated. The experimental observations indicate that the tertiary dendritic arm spacing (λ3), microsegregation and microhardness are affected by the thermal parameters (solidification speed and cooling rate). Solidification speed (SS) associated with increasing cooling rate (RC) are found to contribute to the decreasing tertiary dendritic arm spacing (λ3). However, cooling rates from 11.36 °C/s to 0.65 °C/s were not found to affect significantly the microhardness along the ingot length. The solute concentration (Sn) in solid region were calculated by Scheil and Clyne-Kurz equation, and used in the predictions of microsegregation profiles. The results calculated by equations, have shown deviations from the experimental data. It is well known that it is very difficult to calculate these concentration profiles using the equilibrium partition coefficient, since frequently castings solidify under non-equilibrium conditions and the solidification process is known as non-equilibrium solidification. For this reason, effect of solidification speed (SS) was considered into equations through effective partition coefficient (kef) that has been determined for the range of solidification speed experimentally examined between 0.19 and 0.89 mm/s. However, results calculated by Scheil and Clyne-Kurz equation using the effective partition coefficient (kef), yielded discrepancies from the experimental results. Because of its deviations between calculated and experimental data, an experimental equation with effective partition coefficient (kef), is considered in present work, showing an excellent agreement with the experimental data.

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Paradela, K. G., de Souza Baptista, L. A., Sales, R. C., Junior, P. F., & Ferreira, A. F. (2019). Investigation of thermal parameters effects on the microstructure, microhardness and microsegregation of Cu-Sn alloy directionally solidified under transient heat flow conditions. Materials Research, 22(4). https://doi.org/10.1590/1980-5373-MR-2019-0259

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