Ag-Cu-Ni (Silver-Copper-Nickel)

Abstract

The system was studied initially by [1913Ces] and [1933Gue]. The latter determined the liquid miscibility gap by chemical analysis and their findings agree, in principle, with those of [1913Ces]. The results obtained by [1913Ces] and [1933Gue] are presented in the review published by [1967McD], which deals with silver alloys. [1977Cha] adjusted the liquidus surface formerly based on [1933Gue], in order to obtain consistency with the currently accepted binary data. By applying improved equipment and techniques, [1977Sie] redetermined the phase equilibria; their results show a somewhat lower ternary solubility limit for Ni below 1000°C. [1993Che] and [1996Luo] applied the diffusion couple method to the study of the interfacial reactions between liquid Ag-Cu alloys and pure nickel substrates. The results obtained at 860, 795 and 700°C confirm that (Ag) has almost no solubility of Ni. Binary