Thermal analysis of micro channel heat sink with various shapes of dimples

Abstract

The power density of electronic devices is increasing with technology development. The cooling of electronic systems is essential for controlling the temperature of componenet and avoiding any hot spot. The various micro-devices are now extensively employed in electronic application especially for cooling the integrated circuits (IC, microchip, silicon chip, computer chip, etc.). Micro-channel heat sinks are used in electronics cooling together with different technologies to enhance its heat transfer performance. Because of above, the heat transfer enhancement and pressure drop reduction with four different shaped dimples (Circular shaped, Square shaped, Almond, shaped and oval or Elliptical shaped) in the microchannel, were designed and studied numerically and experimentally under the condition of laminar flow. The results show that use of dimples in the microchannel can enhance heat transfer and decrease flow resistance under the condition of laminar flow. Compared with microchannel heat sink without dimples, the dimpled-microchannel heat sink has a better cooling capacity and can be an attractive choice for cooling of future microelectronics.