This chapter introduces the key functions of solder joints and the various soldering processes. The evolution from leaded to lead-free solder materials is reported. Furthermore, the recent developments of high-temperature solders and composite solders due to the ever demanding functional and service requirements are discussed. The properties of different solder materials and their solder joints are also presented. Finally, reliability studies of the solder materials and their solder joints are discussed in terms of mechanical behavior, temperature cycling, and drop impact.
CITATION STYLE
Nai, S. M. L., Tan, L. B., & Selvanayagam, C. (2015). Solder joint technology. In HandBook of Manufacturing Engineering and Technology (pp. 713–763). Springer-Verlag London Ltd. https://doi.org/10.1007/978-1-4471-4670-4_59
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