Soldering high-purity materials with CU substrate

Abstract

The work deals with joining targets for PVD sputtering. The task was oriented to suggestion of a technology suitable for joining a wide scope of high-purity materials with copper substrate. A solderable coating formed of three Cr/Ni/Ag layers was deposited on high-purity material. The silver layer is dissolved in solder during soldering at formation of intermetallic phases (AgIn2 and Ag3Sn), assuring a good surface wetting in a short time. The shear strength of joints for different In-based solders was determined. The highest strength was achieved with In48Sn solder, with the lowest melting point, what seems to be advantageous from the viewpoint of soldering process.