CITATION STYLE
Lu, J.-Q., Cale, T. S., & Gutmann, R. J. (2006). Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding. In Materials for Information Technology (pp. 405–417). Springer-Verlag. https://doi.org/10.1007/1-84628-235-7_33
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