RESIDUAL STRESS EVOLUTION DURING ENERGETIC PARTICLE BOMBARDMENT OF THIN FILMS

Abstract

1 INTRODUCTION used in industry to modify the near-surface properties of the substrate implanted ions is formed. In the ion implantation process the substrate not only provides a backing for the surface alloy but also contributes the material that makes up part of the surface alloy. In this process, there is a slow transition between the surface modified zone and the substrate. The range of applications for such ion implantation-based surface engineering includes automotive and aerospace components, orthopedic implants, textile-manufacturing components, cutting and machining tools (e.g., punches, tapes, scoring dies, and extrusion dies), etc [1]. In the surface coatings area we consider the physical vapor deposition (PVD) processes such as sputtering and e-beam evaporation used to deposit thin films in a variety of applications such as microelectronics, microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), integrated optoelectronics, etc. The significance of these applications can be appreciated from the simple fact that the PVD equipment market alone is over $150B/year [2]. The primary function of the PVD synthesized thin films in engineering applications is often non-load bearing, e.g., electrical interconnects in integrated circuits, diffusion barriers, adhesion layers, seed layers to promote texture or epitaxy, coatings in magnetic recording media and heads, optical coatings, wear-resistant coatings, etc. However, the presence of residual stresses can adversely affect the properties, performance and long-term reliability of PVD thin A variety of surface modification and surface coating techniques are materials. In the surface modification by ion implantation process, a surface alloy composed of a combination of the substrate elements and the 487