Common metal die attachment for sic power devices operated in an extended junction temperature range

Abstract

A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using eutectic Zn-Al solder (m.p. = 356°C), focusing on preparation and die-shear reliability. Superior wettability and reproducibility were achieved in the soldering process. It was found that the attachments were viable at least for short-term application in a temperature range up to 300°C. Reliability test results revealed that they could withstand storage for 1500 hours at 200°C and thermal cycle stress of 1500 cycles between-40°C and 200°C. © (2012) Trans Tech Publications.