The build-up substrates are generally used for IC package. As the integration of semiconductor has increased, higher performance of insulation material is required for build-up substrates. In this article, the author explains the characteristics of build-up material required for IC package and latest technology trends for next generation.
CITATION STYLE
MAGO, G. (2011). Build-up Material for IC Package Substrates. NIPPON GOMU KYOKAISHI, 84(10), 321–325. https://doi.org/10.2324/gomu.84.321
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