Effect of Applied Potential on the Chemical Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry

  • Kuo H
  • Tsai W
20Citations
Citations of this article
8Readers
Mendeley users who have this article in their library.
Get full text

Abstract

The electrochemical behavior of Al in phosphoric acid base slurry was investigated under chemical mechanical polishing (CMP) condition. The effect of applied potential on the CMP metal removal rate was also evaluated. The results from potentiodynamic polarization curve measurements indicated that a contact pressure in the range of 3 to 9 psi greatly modified the passivation behavior of Al in 5 vol% H 3 PO 4 + 0.5 M citric acid + 5 wt% Al 2 O 3 slurry by a decrease in corrosion potential and an increase in passive current density. The experimental results also showed that CMP removal rate strongly depended on the contact pressure and potential applied. The potential dependence behavior of the removal rate could be divided into three regions depending on the direction of polarization and the magnitude of potential applied. The results of electrochemical impedance spectroscopy and Auger electron spectroscopy examinations showed that passive film formation on Al in the testing slurry was affected by the applied potential, which in term caused a change in the relative contribution of the corrosion and mechanical abrasion to the total removal rate of Al.

References Powered by Scopus

Chemical processes in glass polishing

1017Citations
N/AReaders
Get full text

Bare Surface Reaction Rates and Their Relation to Environment Controlled Cracking of Aluminum Alloys I. Bare Surface Reaction Rates on Aluminum-7 Weight Percent Magnesium in Aqueous Solutions

152Citations
N/AReaders
Get full text

Wear-corrosion mechanism of stainless steel in chloride media

93Citations
N/AReaders
Get full text

Cited by Powered by Scopus

Electrochemical and materials aspects of tribocorrosion systems

122Citations
N/AReaders
Get full text

Electrochemical-mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes

45Citations
N/AReaders
Get full text

Effects of alumina and hydrogen peroxide on the chemical-mechanical polishing of aluminum in phosphoric acid base slurry

41Citations
N/AReaders
Get full text

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Cite

CITATION STYLE

APA

Kuo, H.-S., & Tsai, W.-T. (2000). Effect of Applied Potential on the Chemical Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry. Journal of The Electrochemical Society, 147(6), 2136. https://doi.org/10.1149/1.1393498

Readers over time

‘11‘16‘17‘19‘21‘2400.751.52.253

Readers' Seniority

Tooltip

Professor / Associate Prof. 2

33%

PhD / Post grad / Masters / Doc 2

33%

Lecturer / Post doc 1

17%

Researcher 1

17%

Readers' Discipline

Tooltip

Engineering 3

50%

Materials Science 3

50%

Article Metrics

Tooltip
Social Media
Shares, Likes & Comments: 76

Save time finding and organizing research with Mendeley

Sign up for free
0