Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect

Abstract

The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report that when cutting depth decreases to atomic scale, minimum chip thickness could be down to single atomic layer by mechanical cutting using rounded edge tool. The material removal behaviour during cutting-based single atomic layer removal exhibits four characteristics, including chip formation by shearing-stress driven dislocation motion, elastic deformation on the processed surface, atomic sizing effect, and cutting-edge radius effect. Based on this understanding, a new cutting model is proposed to study the material removal behaviour in cutting-based single atomic layer removal process, significantly different from those for nanocutting and conventional cutting. The outcomes provide theoretical support for the research and development of the atomic and close-to-atomic scale manufacturing technology.