Basic Study on the Evaluation of Thermoplastic Polymers as Hot-Melt Adhesives for Mixed-Substrate Joining

  • Schaible S
  • Bernet C
  • Ledergeber P
  • et al.
N/ACitations
Citations of this article
18Readers
Mendeley users who have this article in their library.

Abstract

A selection of 22 low-melting polymers was thermally and rheologically evaluated to be used as hot-melt adhesives in mixed-substrate joining samples. The choice of polymers was based on the published melting point. It was required to include a broad variety of different polymers back-bones to study the influence of the different polymers comprehensively. A tool-box of widely ap-plicable tests was developed to judge if a thermoplastic polymer is suitable for a hot-melt adhesive application. Melting temperature (onset, peak and offset temperature) and melting enthalpy were determined using standardized methods. Rheological methods were used to characterize the shear rate dependence and the flow behavior at the application temperature. The wetting beha-vior of the polymers was evaluated with contact angle measurements. The adhesive strength of the most promising candidates was analyzed using the Lumi Frac-adhesion method including the failure pattern.

Cite

CITATION STYLE

APA

Schaible, S., Bernet, C., Ledergeber, P., Balmer, T., & Brändli, C. (2016). Basic Study on the Evaluation of Thermoplastic Polymers as Hot-Melt Adhesives for Mixed-Substrate Joining. Open Journal of Applied Sciences, 06(08), 579–592. https://doi.org/10.4236/ojapps.2016.68057

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free