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Chip integration

CRC Press, (2006), 385-469
DOI: 10.1007/978-0-387-79834-9_10
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Abstract

There are two aspects of chip integration: one is concerned with the problems created by topography (Section 6.2 through Section 6.24) and the other with the compatibility of materials and processing (Section 6.25 through Section 6.31).

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Schwartz, G. C., & Srikrishnan, K. V. (2006). Chip integration. In Handbook of Semiconductor Interconnection Technology, Second Edition (pp. 385–469). CRC Press. https://doi.org/10.1007/978-0-387-79834-9_10

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